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Title

Comparative analysis of slenderization methods and their impact on enamel surfaces using SEM: An in vitro study

 

Authors

Hrushikesh Aphale*, Vinnayakk Kalaskar, Sunilkumar Nagmode, Vivek Shinde, Rahul Kolte & Vaishnavi Ingle

 

Affiliation

Department of Orthodontics and Dentofacial Orthopedics, SMBT Dental college and Hospital, MUHS University, Sangamner -422608, Maharashtra, India; *Corresponding author

 

Email

Hrushikesh Aphale - E-mail: hrushiaphale@gmail.com
Vinnayakk Kalaskar - E-mail: kalaskarvinayak5@gmail.com
Sunilkumar Nagmode - E-mail: drnagmode77@gmail.com
Vivek Shinde - E-mail: drvivekshinde002@gmail.com
Rahul Kolte - E-mail: rahulkolte1303@gmail.com
Vaishnavi Ingle - E-mail: VaishnaviIngle10@gmail.com

 

Article Type

Research Article

 

Date

Received October 1, 2025; Revised October 31, 2025; Accepted October 31, 2025, Published October 31, 2025

 

Abstract

Interproximal reduction (IPR) is an orthodontic technique that removes 0.3–0.5 mm of enamel from interproximal surfaces to create space, typically for mild to moderate crowding. It helps reshape approximal contacts and address Bolton's discrepancy. Various methods, including air rotor stripping, diamond-coated disks and abrasive strips, are used for IPR. This study compares three IPR techniques Double-sided oscillating IPR strips, interproximal stripping burs and carborundum discs—by examining their effects on enamel surfaces using scanning electron microscopy (SEM).

 

Keywords

IPR (Interproximal reduction), double-sided oscillating IPR strips, interproximal stripping burs, carborundum discs, scanning electron microscopy (SEM).

 

Citation

Aphale et al. Bioinformation 21(10): 3697-3702 (2025)

 

Edited by

P Kangueane

 

ISSN

0973-2063

 

Publisher

Biomedical Informatics

 

License

This is an Open Access article which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly credited. This is distributed under the terms of the Creative Commons Attribution License.